MG Series: MG22

MG 22 - Double Chamber Series

The MG22 single wafer platform offers a flexible system for various wet chemical applications for the wafers front and back side on a low footprint. With plenty of available configuration options the MG22 platform targets process applications with medium throughput requirements.

With its various configuration options, the MG22 platform covers a wide range of process applications and offers the flexibility for customized solutions to target specific application needs.

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Key Applications

  • Silicon substrate thinning and stress relief
  • Film removal
  • Metal etch and clean
  • Bevel etch and clean
  • Contamination clean
  • Polymer removal

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