MG 22 - Double Chamber Series
The MG22 single wafer platform offers a flexible system for various wet chemical applications for the wafers front and back side on a low footprint. With plenty of available configuration options the MG22 platform targets process applications with medium throughput requirements.
With its various configuration options, the MG22 platform covers a wide range of process applications and offers the flexibility for customized solutions to target specific application needs.
- Silicon substrate thinning and stress relief
- Film removal
- Metal etch and clean
- Bevel etch and clean
- Contamination clean
- Polymer removal