Our MG series wet chemical processors offer single sided wet chemical process applications for the wafers front and back side and support a wide range of process chemistries that are used for etch and clean applications in the semiconductor industry. With our integrated measurement (substrate and film), mix and analytical (chemistries) solutions we offer outstanding flexibility and cost savings.

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Key applications and features

  • Wet clean
  • Wet etch
  • Wafer thinning
  • Surface conditioning
  • Stress relief
  • Underbump metallization etch
  • Post-deflux clean


Endpoint detection

Integrated film and substrate thickness measurement

Sub 100 um ultra thin wafer processing

Processing of two wafer sizes in parallel

Integrated chemical mixing

Concentration based buffering


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